圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Input | Output | Frequency - Max | Voltage - Supply | Operating Temperature | Mounting Type | Package / Case | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Microchip Technology |
IC CLK BUFFER 1:4 750MHZ 16QFN
|
封裝: 16-VFQFN Exposed Pad |
庫存2,304 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:4 750MHZ 16QFN
|
封裝: 16-VFQFN Exposed Pad |
庫存4,128 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
TEN LVCMOS OUTPUT LOW ADDITIVE J
|
封裝: 32-VFQFN Exposed Pad |
庫存2,816 |
|
1 | 3:10 | Yes/No | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | LVCMOS | 200MHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
封裝: 16-VFQFN Exposed Pad |
庫存5,216 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
封裝: 16-VFQFN Exposed Pad |
庫存5,616 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
封裝: 16-VFQFN Exposed Pad |
庫存5,904 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
封裝: 16-VFQFN Exposed Pad |
庫存4,960 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
封裝: 16-VFQFN Exposed Pad |
庫存6,960 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
封裝: 16-VFQFN Exposed Pad |
庫存5,936 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
封裝: 16-VFQFN Exposed Pad |
庫存4,864 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
CITRINE ZL40260 ES4 ENGCBA ETQFP
|
封裝: 32-TQFP Exposed Pad |
庫存4,672 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | LVPECL | 1.6GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 32-TQFP Exposed Pad | 32-eTQFP (7x7) |
||
Microchip Technology |
BUFFER W/ULTRA LOW ADDITIVE JITT
|
封裝: 72-VFQFN Exposed Pad |
庫存3,456 |
|
1 | 1:20 | Yes/Yes | Clock | HCSL | 250MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 3
|
封裝: 48-VFQFN Exposed Pad |
庫存6,080 |
|
1 | 3:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | HCSL, LVCMOS, LVDS, LVPECL | 1.6GHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microchip Technology |
CITRINE ZL40260 ES4 ENGCBA ETQFP
|
封裝: 32-TQFP Exposed Pad |
庫存8,964 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | LVPECL | 1.6GHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 32-TQFP Exposed Pad | 32-eTQFP (7x7) |
||
Microchip Technology |
DB2000Q BUFFER WITH ULTRA LOW JI
|
封裝: 72-VFQFN Exposed Pad |
庫存6,600 |
|
1 | 1:20 | Yes/Yes | Clock | HCSL | 250MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Microchip Technology |
BUFFER W/ULTRA LOW ADDITIVE JITT
|
封裝: 72-VFQFN Exposed Pad |
庫存7,584 |
|
1 | 1:20 | Yes/Yes | Clock | HCSL | 250MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Microchip Technology |
DB2000Q BUFFER WITH ULTRA LOW JI
|
封裝: 72-VFQFN Exposed Pad |
庫存19,740 |
|
1 | 1:20 | Yes/Yes | Clock | HCSL | 250MHz | 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 72-VFQFN Exposed Pad | 72-QFN (10x10) |
||
Microchip Technology |
SINGLE APLL 6-OUTPUT SYNTHESIZER
|
封裝: 20-VFQFN Exposed Pad |
庫存17,088 |
|
1 | 1:4 | Yes/Yes | Clock | HCSL | 400MHz | 2.375V ~ 2.625V, 3.135V ~ 3.465V | -40°C ~ 85°C (TA) | Surface Mount | 20-VFQFN Exposed Pad | 20-QFN (4x4) |
||
Microchip Technology |
10 OUTPUT PROGRAMMABLE FANOUT BU
|
封裝: 56-VFQFN Exposed Pad |
庫存6,360 |
|
1 | 4:10 | Yes/Yes | CMOS, Crystal | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1.035GHz | 1.71V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
6 OUTPUT PROGRAMMABLE FANOUT BUF
|
封裝: 56-VFQFN Exposed Pad |
庫存6,336 |
|
1 | 4:6 | Yes/Yes | CMOS, Crystal | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1.035GHz | 1.71V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 56-VFQFN Exposed Pad | 56-QFN (8x8) |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 3
|
封裝: 48-VFQFN Exposed Pad |
庫存7,568 |
|
1 | 3:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | HCSL, LVCMOS, LVDS, LVPECL | 1.6GHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 48-VFQFN Exposed Pad | 48-QFN (7x7) |
||
Microchip Technology |
6 OUTPUT PROGRAMMABLE FANOUT BUF
|
封裝: - |
庫存7,776 |
|
1 | 4:6 | Yes/Yes | CMOS, Crystal | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1.035GHz | 1.71V ~ 3.465V | -40°C ~ 85°C | - | - | - |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 2
|
封裝: 32-VFQFN Exposed Pad |
庫存9,396 |
|
1 | 2:10 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | LVPECL | 1.6GHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFF MUX 4:3 32QFN
|
封裝: 32-VFQFN Exposed Pad |
庫存8,100 |
|
1 | 4:3 | Yes/Yes | CMOS, Crystal | CML, CMOS, HCSL, HSTL, LVDS, LVPECL, SSTL | 1.035GHz | 1.71V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 2
|
封裝: 40-VFQFN Exposed Pad |
庫存8,688 |
|
1 | 3:5 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | HCSL, LVCMOS, LVDS, LVPECL | 1.6GHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 40-VFQFN Exposed Pad | 40-QFN (6x6) |
||
Microchip Technology |
TEN LVCMOS OUTPUT LOW ADDITIVE J
|
封裝: 32-VFQFN Exposed Pad |
庫存8,460 |
|
1 | 3:10 | Yes/No | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | LVCMOS | 250MHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
LOW SKEW, LOW ADDITIVE JITTER 3
|
封裝: 32-VFQFN Exposed Pad |
庫存6,972 |
|
1 | 3:5 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | HCSL, LVCMOS, LVDS, LVPECL | 1.6GHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:4 750MHZ 16QFN
|
封裝: 16-VFQFN Exposed Pad |
庫存8,856 |
|
1 | 1:4 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVPECL | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |
||
Microchip Technology |
TEN LVCMOS OUTPUT LOW ADDITIVE J
|
封裝: 32-VFQFN Exposed Pad |
庫存6,416 |
|
1 | 3:10 | Yes/No | CML, HCSL, LVCMOS, LVDS, LVPECL, SSTL | LVCMOS | 200MHz | 1.35V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 32-VFQFN Exposed Pad | 32-QFN (5x5) |
||
Microchip Technology |
IC CLK BUFFER 1:2 750MHZ 16QFN
|
封裝: 16-VFQFN Exposed Pad |
庫存10,848 |
|
1 | 1:2 | Yes/Yes | CML, HCSL, LVCMOS, LVDS, LVPECL | LVDS | 750MHz | 2.375V ~ 3.465V | -40°C ~ 85°C | Surface Mount | 16-VFQFN Exposed Pad | 16-QFN (3x3) |