* Please refer to the English Version as our Official Version.
Use of stereoscopic microscope, the appearance of components for 360 ° all-round observation. The focus of observation status include product packaging; chip type, date, batch; printing and packaging state; pin arrangement, coplanar with the plating of the case and so on. Visual inspection can quickly understand the requirement to meet the external requirements of the original brand manufacturers, anti-static and moisture standards, and whether used or refurbished.
This is not a counterfeit detection method as oxidation occurs naturally; however, it is a significant issue for functionality and is particularly prevalent in hot, humid climates such as Southeast Asia and the southern states in North America. The joint standard J-STD-002 defines the test methods and accept/reject criteria for thru-hole, surface mount, and BGA devices. For non-BGA surface mount devices, the dip-and-look is employed and the “ceramic plate test” for BGA devices has recently been incorporate into our suite of services. Devices that are delivered in inappropriate packaging, acceptable packaging but are over one year old, or display contamination on the pins are recommended for solderability testing.
X-ray inspection, the traversal of the components within the 360 ° all-round observation, to determine the internal structure of components under test and package connection status, you can see a large number of samples under test are the same, or a mixture (Mixed-Up ) the problems arise; in addition they have with the specifications (Datasheet) each other than to understand the correctness of the sample under test. Connection status of the test package, to learn about the chip and package connectivity between pins is normal, to exclude the key and open-wire short-circuited.
Through the official datasheet, design test projects, develop testing boards, build test platforms, write test programs, then test various functions of the IC. Through professional and accurate chip function test, it is possible to identify whether the IC function is up to standard. The types of IC currently testable include: logic devices, analog devices, high-frequency ICs, power ICs, various amplifiers, and power management ICs. The package covers DIP, SOP, SSOP, BGA, SOT, TO-220, QFN, QFP, etc. We use programming equipment which support the detection of 47,000 IC models from 208 manufacturers. Offers include: EPROM, parallel and serial EEPROM, FPGA, configuration serial PROM, flash, BPROM, NOVRAM, SPLD, CPLD, EPLD, microcontroller, MCU and standard logic device detection.