圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
---|---|---|---|---|---|---|
NXP |
DIODE ZENER 12V 300MW SMT3
|
封裝: TO-236-3, SC-59, SOT-23-3 |
庫存6,208 |
|
||
NXP |
IC REG LINEAR 3.6V 200MA 5TSOP
|
封裝: SC-74A, SOT-753 |
庫存2,816 |
|
||
NXP |
IC TEMP MONITOR 16SSOP
|
封裝: 16-SSOP (0.154", 3.90mm Width) |
庫存7,664 |
|
||
NXP |
IC SW SERIAL OCTAL 32-SOIC
|
封裝: 32-SSOP (0.295", 7.50mm Width) Exposed Pad |
庫存6,400 |
|
||
NXP |
IC LOAD SWITCH HI SIDE 12WLCSP
|
封裝: 12-UFBGA, WLCSP |
庫存6,848 |
|
||
NXP |
IC OCT D TRANSP LATCH 3ST 20SOIC
|
封裝: 20-SOIC (0.295", 7.50mm Width) |
庫存4,144 |
|
||
NXP |
IC D-TYPE POS TRG DUAL 56TSSOP
|
封裝: 56-TFSOP (0.240", 6.10mm Width) |
庫存7,856 |
|
||
NXP |
IC SER LNK INTER ISO KLINE 8SOIC
|
封裝: 8-SOIC (0.154", 3.90mm Width) |
庫存14,976 |
|
||
NXP |
IC SMART CARD INTERFACE 28TSSOP
|
封裝: 28-TSSOP (0.173", 4.40mm Width) |
庫存273,684 |
|
||
NXP |
IC I/O EXPANDER I2C 16B 24DHVQFN
|
封裝: 24-VFQFN Exposed Pad |
庫存30,168 |
|
||
NXP |
IC MPU MPC85XX 1.333GHZ 1023BGA
|
封裝: 1023-BFBGA, FCBGA |
庫存5,760 |
|
||
NXP |
IC MPU MPC85XX 1.0GHZ 783FCBGA
|
封裝: 783-BBGA, FCBGA |
庫存5,328 |
|
||
NXP |
IC MPU E600 DUAL CORE 1023FCCBGA
|
封裝: 1023-BCBGA, FCCBGA |
庫存2,064 |
|
||
NXP |
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
封裝: 561-FBGA |
庫存4,784 |
|
||
NXP |
IC MPU I.MX23 454MHZ 128LQFP
|
封裝: 128-LQFP |
庫存21,024 |
|
||
NXP |
IC MCU 32BIT 1MB FLASH 144LQFP
|
封裝: 144-LQFP |
庫存2,080 |
|
||
NXP |
IC MCU 32BIT ROMLESS 196MAPBGA
|
封裝: 196-LBGA |
庫存5,328 |
|
||
NXP |
IC MCU 16BIT 128KB FLASH 48LQFP
|
封裝: 48-LQFP |
庫存23,940 |
|
||
NXP |
IC MCU 8BIT 4KB FLASH 8QFN
|
封裝: 8-VDFN Exposed Pad |
庫存18,000 |
|
||
NXP |
IC MCU 64KB LS/HS SWITCH 48LQFP
|
封裝: 48-LQFP Exposed Pad |
庫存2,784 |
|
||
NXP |
IC RTC CLK/CALENDAR I2C 8TSSOP
|
封裝: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
庫存3,344 |
|
||
NXP |
IC SENSOR TEMP I2C/SMBUS 6TSOP
|
封裝: SC-74, SOT-457 |
庫存3,528 |
|
||
NXP |
ACCELEROMETER 112.5G ANAL 16SOIC
|
封裝: 16-SOIC (0.295", 7.50mm Width) |
庫存7,794 |
|
||
NXP |
IC TXRX CONTACTLESS READ 32HVQFN
|
封裝: 32-VFQFN Exposed Pad |
庫存3,582 |
|
||
NXP |
IC IF PROCESSOR MULTISTD 48HVQFN
|
封裝: 48-VFQFN Exposed Pad |
庫存5,508 |
|
||
NXP |
POWER MODULE GSM800 EDGE SOT365C
|
封裝: SOT-365C |
庫存4,752 |
|
||
NXP |
IC MMIC AMP LNA WLCSP6
|
封裝: 6-XFBGA, WLCSP |
庫存2,682 |
|
||
NXP |
IC MMIC AMP LNA WLCSP6
|
封裝: 6-XFBGA, WLCSP |
庫存5,652 |
|
||
NXP |
SYSTEM BASIS CHIP LINEAR 0.5A V
|
封裝: 48-LQFP Exposed Pad |
庫存4,960 |
|
||
NXP |
IC GPIO EXPANDER 34B VFBGA42
|
封裝: 42-VFBGA |
庫存4,080 |
|