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NXP 產品

記錄 26,590
頁  257/887
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BUK762R9-40E/GFJ
NXP

MOSFET N-CH D2PAK

  • Transistor Type: -
  • Current - Collector (Ic) (Max): -
  • Voltage - Collector Emitter Breakdown (Max): -
  • Vce Saturation (Max) @ Ib, Ic: -
  • Current - Collector Cutoff (Max): -
  • DC Current Gain (hFE) (Min) @ Ic, Vce: -
  • Power - Max: -
  • Frequency - Transition: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存7,200
BZX84-C36/LF1R
NXP

DIODE ZENER TO-236AB SOT23

  • Voltage - Zener (Nom) (Vz): 36V
  • Tolerance: ±5%
  • Power - Max: 250mW
  • Impedance (Max) (Zzt): 90 Ohms
  • Current - Reverse Leakage @ Vr: 50nA @ 23.1V
  • Voltage - Forward (Vf) (Max) @ If: 900mV @ 10mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: TO-236AB (SOT23)
封裝: TO-236-3, SC-59, SOT-23-3
庫存7,904
PZM5.6NB1,115
NXP

DIODE ZENER 5.6V 300MW SMT3

  • Voltage - Zener (Nom) (Vz): 5.6V
  • Tolerance: ±2%
  • Power - Max: 300mW
  • Impedance (Max) (Zzt): 40 Ohms
  • Current - Reverse Leakage @ Vr: 2µA @ 2.5V
  • Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
  • Operating Temperature: -65°C ~ 150°C
  • Mounting Type: Surface Mount
  • Package / Case: TO-236-3, SC-59, SOT-23-3
  • Supplier Device Package: SMT3; MPAK
封裝: TO-236-3, SC-59, SOT-23-3
庫存3,840
BAS216,115
NXP

DIODE GEN PURP 75V 250MA SOD2

  • Diode Type: Standard
  • Voltage - DC Reverse (Vr) (Max): 75V
  • Current - Average Rectified (Io): 250mA (DC)
  • Voltage - Forward (Vf) (Max) @ If: 1.25V @ 150mA
  • Speed: Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr): 4ns
  • Current - Reverse Leakage @ Vr: 1µA @ 75V
  • Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
  • Mounting Type: Surface Mount
  • Package / Case: SOD-110
  • Supplier Device Package: SOD110
  • Operating Temperature - Junction: 150°C (Max)
封裝: SOD-110
庫存6,560
74HC74N,652
NXP

IC D-TYPE POS TRG DUAL 14DIP

  • Function: Set(Preset) and Reset
  • Type: D-Type
  • Output Type: Differential
  • Number of Elements: 2
  • Number of Bits per Element: 1
  • Clock Frequency: 82MHz
  • Max Propagation Delay @ V, Max CL: 37ns @ 6V, 50pF
  • Trigger Type: Positive Edge
  • Current - Output High, Low: 5.2mA, 5.2mA
  • Voltage - Supply: 2 V ~ 6 V
  • Current - Quiescent (Iq): 40µA
  • Input Capacitance: 3.5pF
  • Operating Temperature: -40°C ~ 125°C (TA)
  • Mounting Type: Through Hole
  • Package / Case: 14-DIP (0.300", 7.62mm)
封裝: 14-DIP (0.300", 7.62mm)
庫存6,816
74ALVT162240DGG,51
NXP

IC BUFF DVR TRI-ST 16BIT 48TSSOP

  • Logic Type: Buffer, Inverting
  • Number of Elements: 4
  • Number of Bits per Element: 4
  • Input Type: -
  • Output Type: Push-Pull
  • Current - Output High, Low: 12mA, 12mA
  • Voltage - Supply: 2.3 V ~ 2.7 V, 3 V ~ 3.6 V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 48-TFSOP (0.240", 6.10mm Width)
  • Supplier Device Package: 48-TSSOP
封裝: 48-TFSOP (0.240", 6.10mm Width)
庫存6,192
UJA1079TW/3V3,118
NXP

IC SBC LINE 3.3V 32HTSSOP

  • Applications: Automotive
  • Interface: SPI Serial
  • Voltage - Supply: 4.5 V ~ 28 V
  • Package / Case: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
  • Supplier Device Package: 32-HTSSOP
  • Mounting Type: Surface Mount
封裝: 32-TSSOP (0.240", 6.10mm Width) Exposed Pad
庫存2,928
TJA1055T/3/C,518
NXP

IC CAN TXRX FAULT-TOL 14-SOIC

  • Type: Transceiver
  • Protocol: CAN
  • Number of Drivers/Receivers: 1/1
  • Duplex: Half
  • Receiver Hysteresis: -
  • Data Rate: -
  • Voltage - Supply: 4.75 V ~ 5.25 V
  • Operating Temperature: -40°C ~ 125°C
  • Mounting Type: Surface Mount
  • Package / Case: 14-SOIC (0.154", 3.90mm Width)
  • Supplier Device Package: 14-SO
封裝: 14-SOIC (0.154", 3.90mm Width)
庫存24,066
hot P1010NSN5HFA
NXP

IC MPU Q OR IQ 1.0GHZ 425TEBGA

  • Core Processor: PowerPC e500v2
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.0GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10/100/1000 Mbps (3)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (1)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 425-FBGA
  • Supplier Device Package: 425-TEPBGA I (19x19)
封裝: 425-FBGA
庫存7,596
MCIMX356AJM5B
NXP

IC MPU I.MX35 532MHZ 400MAPBGA

  • Core Processor: ARM1136JF-S
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 532MHz
  • Co-Processors/DSP: Multimedia; GPU, IPU, VFP
  • RAM Controllers: LPDDR, DDR2
  • Graphics Acceleration: Yes
  • Display & Interface Controllers: Keypad, KPP, LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Security Features: Secure Fusebox, Secure JTAG
  • Package / Case: 400-LFBGA
  • Supplier Device Package: 400-MAPBGA (17x17)
封裝: 400-LFBGA
庫存4,544
MC8610VT1333JB
NXP

IC MPU MPC86XX 1.333GHZ 783BGA

  • Core Processor: PowerPC e600
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 1.333GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR, DDR2
  • Graphics Acceleration: No
  • Display & Interface Controllers: DIU, LCD
  • Ethernet: -
  • SATA: -
  • USB: -
  • Voltage - I/O: 1.8V, 2.5V, 3.3V
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 783-BBGA, FCBGA
  • Supplier Device Package: 783-FCPBGA (29x29)
封裝: 783-BBGA, FCBGA
庫存6,848
MPC860DPCZQ66D4
NXP

IC MPU MPC8XX 66MHZ 357BGA

  • Core Processor: MPC8xx
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 66MHz
  • Co-Processors/DSP: Communications; CPM
  • RAM Controllers: DRAM
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 10 Mbps (2), 10/100 Mbps (1)
  • SATA: -
  • USB: -
  • Voltage - I/O: 3.3V
  • Operating Temperature: -40°C ~ 95°C (TA)
  • Security Features: -
  • Package / Case: 357-BBGA
  • Supplier Device Package: 357-PBGA (25x25)
封裝: 357-BBGA
庫存3,232
P5020NSN7QMB
NXP

IC MPU Q OR IQ 2.0GHZ 1295FCBGA

  • Core Processor: PowerPC e5500
  • Number of Cores/Bus Width: 2 Core, 64-Bit
  • Speed: 2.0GHz
  • Co-Processors/DSP: -
  • RAM Controllers: DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: -
  • Ethernet: 1 Gbps (5), 10 Gbps (1)
  • SATA: SATA 3Gbps (2)
  • USB: USB 2.0 + PHY (2)
  • Voltage - I/O: -
  • Operating Temperature: 0°C ~ 105°C (TA)
  • Security Features: -
  • Package / Case: 1295-BBGA, FCBGA
  • Supplier Device Package: 1295-FCPBGA (37.5x37.5)
封裝: 1295-BBGA, FCBGA
庫存5,872
MCIMX6Y1CVM05AA
NXP

I.MX 32-BIT MPU, ARM CORTEX-A7 C

  • Core Processor: ARM? Cortex?-A7
  • Number of Cores/Bus Width: 1 Core, 32-Bit
  • Speed: 528MHz
  • Co-Processors/DSP: Multimedia; NEON? MPE
  • RAM Controllers: LPDDR2, DDR3, DDR3L
  • Graphics Acceleration: No
  • Display & Interface Controllers: Electrophoretic, LCD
  • Ethernet: 10/100 Mbps (1)
  • SATA: -
  • USB: USB 2.0 OTG + PHY (2)
  • Voltage - I/O: 1.8V, 2.8V, 3.3V
  • Operating Temperature: -40°C ~ 105°C (TJ)
  • Security Features: A-HAB, ARM TZ, CSU, SJC, SNVS
  • Package / Case: 289-LFBGA
  • Supplier Device Package: 289-MAPBGA (14x14)
封裝: 289-LFBGA
庫存6,448
MK10DX128ZVMD10R
NXP

IC MCU 32BIT 128KB FLASH 144BGA

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 100MHz
  • Connectivity: CAN, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
  • Peripherals: DMA, I2S, LVD, POR, PWM, WDT
  • Number of I/O: 104
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 16K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 46x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LBGA
  • Supplier Device Package: 144-MAPBGA (13x13)
封裝: 144-LBGA
庫存6,384
LPC11U37FBD48/501,
NXP

IC MCU 32BIT 128KB FLASH 48LQFP

  • Core Processor: ARM? Cortex?-M0
  • Core Size: 32-Bit
  • Speed: 50MHz
  • Connectivity: I2C, Microwire, SmartCard, SPI, SSP, UART/USART, USB
  • Peripherals: Brown-out Detect/Reset, POR, WDT
  • Number of I/O: 40
  • Program Memory Size: 128KB (128K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 4K x 8
  • RAM Size: 12K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 8x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-LQFP
  • Supplier Device Package: 48-LQFP (7x7)
封裝: 48-LQFP
庫存3,168
PXAG37KFA,512
NXP

IC MCU 16BIT 32KB OTP 44PLCC

  • Core Processor: XA
  • Core Size: 16-Bit
  • Speed: 30MHz
  • Connectivity: UART/USART
  • Peripherals: PWM, WDT
  • Number of I/O: 32
  • Program Memory Size: 32KB (32K x 8)
  • Program Memory Type: OTP
  • EEPROM Size: -
  • RAM Size: 512 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 44-LCC (J-Lead)
  • Supplier Device Package: 44-PLCC (16.59x16.59)
封裝: 44-LCC (J-Lead)
庫存5,024
hot MC68HC908JK1ECDW
NXP

IC MCU 8BIT 1.5KB FLASH 20SOIC

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: -
  • Peripherals: LED, LVD, POR, PWM
  • Number of I/O: 15
  • Program Memory Size: 1.5KB (1.5K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
  • Data Converters: A/D 12x8b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 20-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 20-SOIC
封裝: 20-SOIC (0.295", 7.50mm Width)
庫存7,140
MC68332ACPV20
NXP

IC MCU 32BIT ROMLESS 144LQFP

  • Core Processor: CPU32
  • Core Size: 32-Bit
  • Speed: 20MHz
  • Connectivity: EBI/EMI, SCI, SPI, UART/USART
  • Peripherals: POR, PWM, WDT
  • Number of I/O: 15
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 4.5 V ~ 5.5 V
  • Data Converters: -
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
封裝: 144-LQFP
庫存4,208
MKV42F256VLH16
NXP

IC MCU 32BIT 256KB FLASH LQFP 64

  • Core Processor: ARM? Cortex?-M4
  • Core Size: 32-Bit
  • Speed: 168MHz
  • Connectivity: CAN, I2C, SPI, UART/USART
  • Peripherals: DMA, LVD, POR, PWM, WDT
  • Number of I/O: 48
  • Program Memory Size: 256KB (256K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 32K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 29x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: 64-LQFP
  • Supplier Device Package: 64-LQFP (10x10)
封裝: 64-LQFP
庫存4,048
MC9S08LL16CGT
NXP

IC MCU 8BIT 16KB FLASH 48QFN

  • Core Processor: S08
  • Core Size: 8-Bit
  • Speed: 20MHz
  • Connectivity: I2C, SCI, SPI
  • Peripherals: LCD, LVD, POR, PWM, WDT
  • Number of I/O: 31
  • Program Memory Size: 16KB (16K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 1.8 V ~ 3.6 V
  • Data Converters: A/D 8x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 48-VFQFN Exposed Pad
  • Supplier Device Package: 48-QFN-EP (7x7)
封裝: 48-VFQFN Exposed Pad
庫存6,224
hot MC908JL3ECDWE
NXP

IC MCU 8BIT 4KB FLASH 28SOIC

  • Core Processor: HC08
  • Core Size: 8-Bit
  • Speed: 8MHz
  • Connectivity: -
  • Peripherals: LED, LVD, POR, PWM
  • Number of I/O: 23
  • Program Memory Size: 4KB (4K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128 x 8
  • Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.3 V
  • Data Converters: A/D 12x8b
  • Oscillator Type: External
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 28-SOIC (0.295", 7.50mm Width)
  • Supplier Device Package: 28-SOIC
封裝: 28-SOIC (0.295", 7.50mm Width)
庫存15,480
KMSC8122VT8000
NXP

DSP 16BIT QUAD 500MHZ 431FCBGA

  • Type: SC140 Core
  • Interface: DSI, Ethernet, RS-232
  • Clock Rate: 500MHz
  • Non-Volatile Memory: External
  • On-Chip RAM: 1.436MB
  • Voltage - I/O: 3.30V
  • Voltage - Core: 1.20V
  • Operating Temperature: 0°C ~ 90°C (TJ)
  • Mounting Type: Surface Mount
  • Package / Case: 431-BFBGA, FCBGA
  • Supplier Device Package: 431-FCPBGA (20x20)
封裝: 431-BFBGA, FCBGA
庫存5,136
PCF8591P,112
NXP

IC ADC/DAC 8-BIT I2C 16-DIP

  • Type: ADC, DAC
  • Number of Channels: -
  • Resolution (Bits): 8 b
  • Sampling Rate (Per Second): 11.1k
  • Data Interface: I2C, Serial
  • Voltage Supply Source: Single Supply
  • Voltage - Supply: 2.5 V ~ 6 V
  • Operating Temperature: -40°C ~ 85°C
  • Mounting Type: Through Hole
  • Package / Case: 16-DIP (0.300", 7.62mm)
  • Supplier Device Package: 16-DIP
封裝: 16-DIP (0.300", 7.62mm)
庫存5,680
SL3S1203FTB0,115
NXP

IC UCODE G2XL SOT886

  • Type: RFID Transponder
  • Frequency: 840MHz ~ 960MHz
  • Standards: ISO 18000-6, EPC
  • Interface: -
  • Voltage - Supply: 1.8V
  • Operating Temperature: -40°C ~ 85°C
  • Package / Case: 6-XFDFN
  • Supplier Device Package: 6-XSON, SOT886 (1.45x1)
封裝: 6-XFDFN
庫存3,096
MRF1K50H-TF1
NXP

MRF1K50H 87.5-108 MHZ EVAL BOARD

  • Type: Transistor
  • Frequency: 87.5MHz ~ 108MHz
  • For Use With/Related Products: MRF1K50H
  • Supplied Contents: Board
封裝: -
庫存4,860
MK22FN512VLH12R
NXP

KINETIS K 32-BIT MCU ARM CORTEX

  • Core Processor: ARM® Cortex®-M4
  • Core Size: 32-Bit
  • Speed: 120MHz
  • Connectivity: I²C, IrDA, SPI, UART/USART, USB, USB OTG
  • Peripherals: DMA, I²S, LVD, POR, PWM, WDT
  • Number of I/O: 40
  • Program Memory Size: 512KB (512K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: -
  • RAM Size: 128K x 8
  • Voltage - Supply (Vcc/Vdd): 1.71 V ~ 3.6 V
  • Data Converters: A/D 22x16b, D/A 2x12b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 105°C (TA)
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
庫存3,824
S9S12VR64AF0CLC
NXP

MAGNIV 16-BIT MCU S12 CORE 64K

  • Core Processor: 12V1
  • Core Size: 16-Bit
  • Speed: 25MHz
  • Connectivity: IrDA, LINbus, SCI, SPI
  • Peripherals: LVD, POR, PWM, WDT
  • Number of I/O: 16
  • Program Memory Size: 64KB (64K x 8)
  • Program Memory Type: FLASH
  • EEPROM Size: 512 x 8
  • RAM Size: 2K x 8
  • Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
  • Data Converters: A/D 2x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: -
  • Package / Case: 32-LQFP
  • Supplier Device Package: 32-LQFP (7x7)
封裝: 32-LQFP
庫存7,408
LPC4330FBD144Y
NXP

IC MCU 32BIT ROMLESS 144LQFP

  • Core Processor: ARM® Cortex®-M0, ARM® Cortex®-M4
  • Core Size: 32-Bit Dual-Core
  • Speed: 204MHz
  • Connectivity: CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
  • Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
  • Number of I/O: 83
  • Program Memory Size: -
  • Program Memory Type: ROMless
  • EEPROM Size: -
  • RAM Size: 264K x 8
  • Voltage - Supply (Vcc/Vdd): 2.2V ~ 3.6V
  • Data Converters: A/D 8x10b; D/A 1x10b
  • Oscillator Type: Internal
  • Operating Temperature: -40°C ~ 85°C (TA)
  • Mounting Type: Surface Mount
  • Package / Case: 144-LQFP
  • Supplier Device Package: 144-LQFP (20x20)
封裝: -
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MC33FS8510B6ESR2
NXP

FS8500

  • Applications: -
  • Current - Supply: -
  • Voltage - Supply: -
  • Operating Temperature: -
  • Mounting Type: -
  • Package / Case: -
  • Supplier Device Package: -
封裝: -
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