頁 648 - NXP 產品 | 黑森爾電子

零件編號	製造商	描述	封裝	庫存
BUK9E1R6-30E,127	NXP	MOSFET N-CH 30V 120A I2PAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 120A (Tc) Drive Voltage (Max Rds On, Min Rds On): 5V, 10V Vgs(th) (Max) @ Id: 2.1V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 113nC @ 5V Input Capacitance (Ciss) (Max) @ Vds: 16150pF @ 25V Vgs (Max): ±10V FET Feature: - Power Dissipation (Max): 349W (Tc) Rds On (Max) @ Id, Vgs: 1.4 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Supplier Device Package: I2PAK Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA	封裝: TO-262-3 Long Leads, I2Pak, TO-262AA	庫存3,248
PSMN9R0-25YLC,115	NXP	MOSFET N-CH 25V 46A LL LFPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 25V Current - Continuous Drain (Id) @ 25°C: 46A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 1.95V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 12nC @ 10V Input Capacitance (Ciss) (Max) @ Vds: 694pF @ 12V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 34W (Tc) Rds On (Max) @ Id, Vgs: 9.1 mOhm @ 15A, 10V Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Supplier Device Package: LFPAK56, Power-SO8 Package / Case: SC-100, SOT-669	封裝: SC-100, SOT-669	庫存7,776
PH6030L,115	NXP	MOSFET N-CH 30V 76.7A LFPAK FET Type: N-Channel Technology: MOSFET (Metal Oxide) Drain to Source Voltage (Vdss): 30V Current - Continuous Drain (Id) @ 25°C: 76.7A (Tc) Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V Vgs(th) (Max) @ Id: 2.15V @ 1mA Gate Charge (Qg) (Max) @ Vgs: 15.2nC @ 4.5V Input Capacitance (Ciss) (Max) @ Vds: 2260pF @ 12V Vgs (Max): ±20V FET Feature: - Power Dissipation (Max): 62.5W (Tc) Rds On (Max) @ Id, Vgs: 6 mOhm @ 25A, 10V Operating Temperature: -55°C ~ 150°C (TJ) Mounting Type: Surface Mount Supplier Device Package: LFPAK56, Power-SO8 Package / Case: SC-100, SOT-669	封裝: SC-100, SOT-669	庫存2,432
MRF5S21045NR1	NXP	FET RF 68V 2.12GHZ TO270-4 Transistor Type: LDMOS Frequency: 2.12GHz Gain: 14.5dB Voltage - Test: 28V Current Rating: - Noise Figure: - Current - Test: 500mA Power - Output: 10W Voltage - Rated: 68V Package / Case: TO-270AB Supplier Device Package: TO-270 WB-4	封裝: TO-270AB	庫存5,264
BFG540,215	NXP	TRANS RF 15V 9GHZ SOT143B Transistor Type: NPN Voltage - Collector Emitter Breakdown (Max): 15V Frequency - Transition: 9GHz Noise Figure (dB Typ @ f): 1.3dB ~ 1.8dB @ 900MHz Gain: - Power - Max: 400mW DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 40mA, 8V Current - Collector (Ic) (Max): 120mA Operating Temperature: 150°C (TJ) Mounting Type: Surface Mount Package / Case: TO-253-4, TO-253AA Supplier Device Package: SOT-143B	封裝: TO-253-4, TO-253AA	庫存5,600
PZM11NB2A,115	NXP	DIODE ZENER 11V 220MW SMT3 Voltage - Zener (Nom) (Vz): 11V Tolerance: ±2% Power - Max: 220mW Impedance (Max) (Zzt): 10 Ohms Current - Reverse Leakage @ Vr: 100nA @ 8V Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA Operating Temperature: - Mounting Type: Surface Mount Package / Case: TO-236-3, SC-59, SOT-23-3 Supplier Device Package: SMT3; MPAK	封裝: TO-236-3, SC-59, SOT-23-3	庫存6,960
MCZ33395EW	NXP	IC MOTOR CONTROLLER PAR 32SOIC Motor Type - Stepper: - Motor Type - AC, DC: Brushless DC (BLDC) Function: Controller - Commutation, Direction Management Output Configuration: Pre-Driver - Half Bridge (3) Interface: PWM Technology: Power MOSFET Step Resolution: - Applications: General Purpose Current - Output: - Voltage - Supply: 5.5 V ~ 24 V Voltage - Load: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 32-SOIC (0.295", 7.50mm Width) Supplier Device Package: 32-SOIC	封裝: 32-SOIC (0.295", 7.50mm Width)	庫存7,936
74ABT657DB,118	NXP	IC TRANSCVR TRI-ST 8BIT 24SSOP Logic Type: Transceiver, Non-Inverting Number of Elements: 1 Number of Bits per Element: 8 Input Type: - Output Type: Push-Pull Current - Output High, Low: 32mA, 64mA Voltage - Supply: 4.5 V ~ 5.5 V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 24-SSOP (0.209", 5.30mm Width) Supplier Device Package: 24-SSOP	封裝: 24-SSOP (0.209", 5.30mm Width)	庫存5,888
MCZ33903B5EKR2	NXP	IC SBC CAN HS 5.0V 32SOIC Applications: System Basis Chip Interface: CAN Voltage - Supply: 5.5 V ~ 28 V Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad Supplier Device Package: 32-SOIC EP Mounting Type: Surface Mount	封裝: 32-SSOP (0.295", 7.50mm Width) Exposed Pad	庫存5,232
TDA19978BHV/15/C1:	NXP	IC HDMI INTERFACE 144HLQFP Applications: HDTV Interface: HDMI Voltage - Supply: 1.8V, 3.3V Package / Case: 144-LQFP Exposed Pad Supplier Device Package: 144-HLQFP (20x20) Mounting Type: Surface Mount	封裝: 144-LQFP Exposed Pad	庫存6,848
PCA9515ADP,118	NXP	IC REDRIVER I2C 1CH 8TSSOP Type: Buffer, ReDriver Applications: I2C Input: 2-Wire Bus Output: 2-Wire Bus Data Rate (Max): 400kHz Number of Channels: 1 Delay Time: - Signal Conditioning: - Capacitance - Input: 6pF Voltage - Supply: 2.3 V ~ 3.6 V Current - Supply: 800µA Operating Temperature: -40°C ~ 85°C Mounting Type: - Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Supplier Device Package: 8-TSSOP	封裝: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)	庫存110,106
MPC8360ZUAJDGA	NXP	IC MPU MPC83XX 533MHZ 740TBGA Core Processor: PowerPC e300 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 533MHz Co-Processors/DSP: Communications; QUICC Engine RAM Controllers: DDR, DDR2 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (1) SATA: - USB: USB 1.x (1) Voltage - I/O: 1.8V, 2.5V, 3.3V Operating Temperature: 0°C ~ 105°C (TA) Security Features: - Package / Case: 740-LBGA Supplier Device Package: 740-TBGA (37.5x37.5)	封裝: 740-LBGA	庫存14,160
MC68302CRC20C	NXP	IC MPU M683XX 20MHZ 132PGA Core Processor: M68000 Number of Cores/Bus Width: 1 Core, 8/16-Bit Speed: 20MHz Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: 5.0V Operating Temperature: -40°C ~ 85°C (TA) Security Features: - Package / Case: 132-BEPGA Supplier Device Package: 132-PGA (34.5x34.5)	封裝: 132-BEPGA	庫存3,584
P1012NXE2HFB	NXP	IC MPU Q OR IQ 800MHZ 689TEBGA Core Processor: PowerPC e500v2 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 800MHz Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3 RAM Controllers: DDR2, DDR3 Graphics Acceleration: No Display & Interface Controllers: - Ethernet: 10/100/1000 Mbps (3) SATA: - USB: USB 2.0 + PHY (2) Voltage - I/O: - Operating Temperature: -40°C ~ 105°C (TA) Security Features: Cryptography, Random Number Generator Package / Case: 689-BBGA Exposed Pad Supplier Device Package: 689-TEPBGA II (31x31)	封裝: 689-BBGA Exposed Pad	庫存3,776
MCIMX6D6AVT10ADR	NXP	IC MPU I.MX6D 1.0GHZ 624FCBGA Core Processor: ARM? Cortex?-A9 Number of Cores/Bus Width: 2 Core, 32-Bit Speed: 1.0GHz Co-Processors/DSP: Multimedia; NEON? SIMD RAM Controllers: LPDDR2, LVDDR3, DDR3 Graphics Acceleration: Yes Display & Interface Controllers: Keypad, LCD Ethernet: 10/100/1000 Mbps (1) SATA: SATA 3Gbps (1) USB: USB 2.0 + PHY (4) Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case: 624-FBGA, FCBGA Supplier Device Package: 624-FCBGA (21x21)	封裝: 624-FBGA, FCBGA	庫存2,768
PC9S08AC128CFUE	NXP	IC MCU 8BIT 128KB FLASH 64QFP Core Processor: S08 Core Size: 8-Bit Speed: 40MHz Connectivity: I2C, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 54 Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 8K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V Data Converters: A/D 16x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 64-QFP Supplier Device Package: 64-QFP (14x14)	封裝: 64-QFP	庫存3,744
P87LPC764BDH,512	NXP	IC MCU 8BIT 4KB OTP 20TSSOP Core Processor: 8051 Core Size: 8-Bit Speed: 20MHz Connectivity: I2C, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, WDT Number of I/O: 18 Program Memory Size: 4KB (4K x 8) Program Memory Type: OTP EEPROM Size: - RAM Size: 128 x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 6 V Data Converters: - Oscillator Type: Internal Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: - Package / Case: 20-TSSOP (0.173", 4.40mm Width) Supplier Device Package: 20-TSSOP	封裝: 20-TSSOP (0.173", 4.40mm Width)	庫存7,744
MMC2114CFCVF33	NXP	IC MCU 32BIT 256KB FLASH 196BGA Core Processor: M210 Core Size: 32-Bit Speed: 33MHz Connectivity: EBI/EMI, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 104 Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 196-LBGA Supplier Device Package: 196-MAPBGA (15x15)	封裝: 196-LBGA	庫存5,040
MPC5125YVN400R	NXP	IC MCU 32BIT ROMLESS 324TEPBGA Core Processor: e300 Core Size: 32-Bit Speed: 400MHz Connectivity: CAN, EBI/EMI, Ethernet, I2C, USB OTG Peripherals: DMA, WDT Number of I/O: 64 Program Memory Size: - Program Memory Type: ROMless EEPROM Size: - RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V Data Converters: - Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TJ) Mounting Type: - Package / Case: 324-BBGA Supplier Device Package: 324-TEPBGA (23x23)	封裝: 324-BBGA	庫存6,400
S9S12GN32F0CLFR	NXP	IC MCU 16BIT 32KB FLASH 48LQFP Core Processor: 12V1 Core Size: 16-Bit Speed: 25MHz Connectivity: IrDA, LIN, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 40 Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH EEPROM Size: 1K x 8 RAM Size: 2K x 8 Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V Data Converters: A/D 8x10b Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存4,672
MC56F82746VLF	NXP	IC MCU 32BIT 64KB FLASH 48LQFP Core Processor: 56800EX Core Size: 32-Bit Speed: 100MHz Connectivity: CAN, I2C, SCI, SPI Peripherals: DMA, POR, PWM, WDT Number of I/O: 39 Program Memory Size: 64KB (32K x 16) Program Memory Type: FLASH EEPROM Size: - RAM Size: 4K x 16 Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V Data Converters: A/D 10x12b; D/A 2x12b Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: - Package / Case: 48-LQFP Supplier Device Package: 48-LQFP (7x7)	封裝: 48-LQFP	庫存7,668
PCK9446BD,151	NXP	IC CLK BUFFER 2:10 250MHZ 32LQFP Type: Fanout Buffer (Distribution), Divider, Multiplexer Number of Circuits: 1 Ratio - Input:Output: 2:10 Differential - Input:Output: No/No Input: LVCMOS Output: LVCMOS Frequency - Max: 250MHz Voltage - Supply: 2.375 V ~ 3.465 V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 32-LQFP Supplier Device Package: 32-LQFP (7x7)	封裝: 32-LQFP	庫存3,840
PCKV857DGG,512	NXP	IC CLK BUF DDR 190MHZ 1CIRC PLL: Yes Main Purpose: Memory, DDR, SDRAM Input: SSTL-2 Output: SSTL-2 Number of Circuits: 1 Ratio - Input:Output: 1:10 Differential - Input:Output: Yes/Yes Frequency - Max: 190MHz Voltage - Supply: 2.3 V ~ 2.7 V Operating Temperature: 0°C ~ 70°C Mounting Type: Surface Mount Package / Case: 48-TFSOP (0.240", 6.10mm Width) Supplier Device Package: 48-TSSOP	封裝: 48-TFSOP (0.240", 6.10mm Width)	庫存2,592
MMA5212AKW	NXP	ACCELEROMETER 120G SPI 16QFN Type: Digital Axis: X Acceleration Range: ±120g Sensitivity (LSB/g): 4 Sensitivity (mV/g): - Bandwidth: - Output Type: SPI Voltage - Supply: 4.2 V ~ 17 V Features: - Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN (6x6)	封裝: 16-QFN Exposed Pad	庫存4,896
MMA6853BKCWR2	NXP	ACCELEROMETER 10BIT SPI 16QFN Type: Digital Axis: X, Y Acceleration Range: - Sensitivity (LSB/g): - Sensitivity (mV/g): - Bandwidth: - Output Type: SPI Voltage - Supply: 3.135 V ~ 5.25 V Features: - Operating Temperature: -40°C ~ 105°C Mounting Type: Surface Mount Package / Case: 16-QFN Exposed Pad Supplier Device Package: 16-QFN-EP (6x6)	封裝: 16-QFN Exposed Pad	庫存7,938
MW5IC2030MBR1	NXP	IC PWR AMP RF 26V 30W TO-272-16 Frequency: 1.93GHz ~ 1.99GHz P1dB: - Gain: 23dB Noise Figure: - RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA Voltage - Supply: 26V Current - Supply: 160mA Test Frequency: - Package / Case: TO-272-16 Variant, Flat Leads Supplier Device Package: TO-272 WB-16	封裝: TO-272-16 Variant, Flat Leads	庫存17,544
MMZ09332BT1	NXP	IC AMP HBT INGAP Frequency: 130MHz ~ 1GHz P1dB: 32dBm Gain: 31dB Noise Figure: - RF Type: LTE, TDS-CDMA, W-CDMA Voltage - Supply: 5V Current - Supply: 240mA Test Frequency: 1GHz Package / Case: 12-VFQFN Exposed Pad Supplier Device Package: 12-QFN (3x3)	封裝: 12-VFQFN Exposed Pad	庫存7,506
UJA1135HW/5V0Y	NXP	IC TRANSCEIVER Applications: - Current - Supply: - Voltage - Supply: - Operating Temperature: - Mounting Type: - Package / Case: - Supplier Device Package: -	封裝: -	庫存7,120
LS1012AXN7EKB	NXP	LS1012A XT 600MHZ RV2 Core Processor: - Number of Cores/Bus Width: - Speed: - Co-Processors/DSP: - RAM Controllers: - Graphics Acceleration: - Display & Interface Controllers: - Ethernet: - SATA: - USB: - Voltage - I/O: - Operating Temperature: - Security Features: - Package / Case: - Supplier Device Package: -	封裝: -	庫存7,440
S912XET512BMAGR	NXP	16-BIT MCU S12X CORE 512KB FLA Core Processor: HCS12X Core Size: 16-Bit Speed: 50MHz Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI Peripherals: LVD, POR, PWM, WDT Number of I/O: 119 Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH EEPROM Size: 4K x 8 RAM Size: 32K x 8 Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V Data Converters: A/D 24x12b Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: - Package / Case: 144-LQFP Supplier Device Package: 144-LQFP (20x20)	封裝: 144-LQFP	庫存6,480

BUK9E1R6-30E,127

NXP

MOSFET N-CH 30V 120A I2PAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Vgs(th) (Max) @ Id: 2.1V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 113nC @ 5V
Input Capacitance (Ciss) (Max) @ Vds: 16150pF @ 25V
Vgs (Max): ±10V
FET Feature: -
Power Dissipation (Max): 349W (Tc)
Rds On (Max) @ Id, Vgs: 1.4 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Supplier Device Package: I2PAK
Package / Case: TO-262-3 Long Leads, I2Pak, TO-262AA

封裝: TO-262-3 Long Leads, I2Pak, TO-262AA

庫存3,248

PSMN9R0-25YLC,115

NXP

MOSFET N-CH 25V 46A LL LFPAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 25V
Current - Continuous Drain (Id) @ 25°C: 46A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs(th) (Max) @ Id: 1.95V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 12nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds: 694pF @ 12V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 34W (Tc)
Rds On (Max) @ Id, Vgs: 9.1 mOhm @ 15A, 10V
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: LFPAK56, Power-SO8
Package / Case: SC-100, SOT-669

封裝: SC-100, SOT-669

庫存7,776

PH6030L,115

NXP

MOSFET N-CH 30V 76.7A LFPAK

FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 76.7A (Tc)
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs(th) (Max) @ Id: 2.15V @ 1mA
Gate Charge (Qg) (Max) @ Vgs: 15.2nC @ 4.5V
Input Capacitance (Ciss) (Max) @ Vds: 2260pF @ 12V
Vgs (Max): ±20V
FET Feature: -
Power Dissipation (Max): 62.5W (Tc)
Rds On (Max) @ Id, Vgs: 6 mOhm @ 25A, 10V
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Supplier Device Package: LFPAK56, Power-SO8
Package / Case: SC-100, SOT-669

封裝: SC-100, SOT-669

庫存2,432

MRF5S21045NR1

NXP

FET RF 68V 2.12GHZ TO270-4

Transistor Type: LDMOS
Frequency: 2.12GHz
Gain: 14.5dB
Voltage - Test: 28V
Current Rating: -
Noise Figure: -
Current - Test: 500mA
Power - Output: 10W
Voltage - Rated: 68V
Package / Case: TO-270AB
Supplier Device Package: TO-270 WB-4

封裝: TO-270AB

庫存5,264

BFG540,215

NXP

TRANS RF 15V 9GHZ SOT143B

Transistor Type: NPN
Voltage - Collector Emitter Breakdown (Max): 15V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 1.8dB @ 900MHz
Gain: -
Power - Max: 400mW
DC Current Gain (hFE) (Min) @ Ic, Vce: 60 @ 40mA, 8V
Current - Collector (Ic) (Max): 120mA
Operating Temperature: 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-253-4, TO-253AA
Supplier Device Package: SOT-143B

封裝: TO-253-4, TO-253AA

庫存5,600

PZM11NB2A,115

NXP

DIODE ZENER 11V 220MW SMT3

Voltage - Zener (Nom) (Vz): 11V
Tolerance: ±2%
Power - Max: 220mW
Impedance (Max) (Zzt): 10 Ohms
Current - Reverse Leakage @ Vr: 100nA @ 8V
Voltage - Forward (Vf) (Max) @ If: 1.1V @ 100mA
Operating Temperature: -
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Supplier Device Package: SMT3; MPAK

封裝: TO-236-3, SC-59, SOT-23-3

庫存6,960

MCZ33395EW

NXP

IC MOTOR CONTROLLER PAR 32SOIC

Motor Type - Stepper: -
Motor Type - AC, DC: Brushless DC (BLDC)
Function: Controller - Commutation, Direction Management
Output Configuration: Pre-Driver - Half Bridge (3)
Interface: PWM
Technology: Power MOSFET
Step Resolution: -
Applications: General Purpose
Current - Output: -
Voltage - Supply: 5.5 V ~ 24 V
Voltage - Load: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 32-SOIC (0.295", 7.50mm Width)
Supplier Device Package: 32-SOIC

封裝: 32-SOIC (0.295", 7.50mm Width)

庫存7,936

74ABT657DB,118

NXP

IC TRANSCVR TRI-ST 8BIT 24SSOP

Logic Type: Transceiver, Non-Inverting
Number of Elements: 1
Number of Bits per Element: 8
Input Type: -
Output Type: Push-Pull
Current - Output High, Low: 32mA, 64mA
Voltage - Supply: 4.5 V ~ 5.5 V
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: Surface Mount
Package / Case: 24-SSOP (0.209", 5.30mm Width)
Supplier Device Package: 24-SSOP

封裝: 24-SSOP (0.209", 5.30mm Width)

庫存5,888

MCZ33903B5EKR2

NXP

IC SBC CAN HS 5.0V 32SOIC

Applications: System Basis Chip
Interface: CAN
Voltage - Supply: 5.5 V ~ 28 V
Package / Case: 32-SSOP (0.295", 7.50mm Width) Exposed Pad
Supplier Device Package: 32-SOIC EP
Mounting Type: Surface Mount

封裝: 32-SSOP (0.295", 7.50mm Width) Exposed Pad

庫存5,232

TDA19978BHV/15/C1:

NXP

IC HDMI INTERFACE 144HLQFP

Applications: HDTV
Interface: HDMI
Voltage - Supply: 1.8V, 3.3V
Package / Case: 144-LQFP Exposed Pad
Supplier Device Package: 144-HLQFP (20x20)
Mounting Type: Surface Mount

封裝: 144-LQFP Exposed Pad

庫存6,848

PCA9515ADP,118

NXP

IC REDRIVER I2C 1CH 8TSSOP

Type: Buffer, ReDriver
Applications: I2C
Input: 2-Wire Bus
Output: 2-Wire Bus
Data Rate (Max): 400kHz
Number of Channels: 1
Delay Time: -
Signal Conditioning: -
Capacitance - Input: 6pF
Voltage - Supply: 2.3 V ~ 3.6 V
Current - Supply: 800µA
Operating Temperature: -40°C ~ 85°C
Mounting Type: -
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Supplier Device Package: 8-TSSOP

封裝: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)

庫存110,106

MPC8360ZUAJDGA

NXP

IC MPU MPC83XX 533MHZ 740TBGA

Core Processor: PowerPC e300
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 533MHz
Co-Processors/DSP: Communications; QUICC Engine
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (1)
SATA: -
USB: USB 1.x (1)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Operating Temperature: 0°C ~ 105°C (TA)
Security Features: -
Package / Case: 740-LBGA
Supplier Device Package: 740-TBGA (37.5x37.5)

封裝: 740-LBGA

庫存14,160

MC68302CRC20C

NXP

IC MPU M683XX 20MHZ 132PGA

Core Processor: M68000
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Speed: 20MHz
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: 5.0V
Operating Temperature: -40°C ~ 85°C (TA)
Security Features: -
Package / Case: 132-BEPGA
Supplier Device Package: 132-PGA (34.5x34.5)

封裝: 132-BEPGA

庫存3,584

P1012NXE2HFB

NXP

IC MPU Q OR IQ 800MHZ 689TEBGA

Core Processor: PowerPC e500v2
Number of Cores/Bus Width: 1 Core, 32-Bit
Speed: 800MHz
Co-Processors/DSP: Communications; QUICC Engine, Security; SEC 3.3
RAM Controllers: DDR2, DDR3
Graphics Acceleration: No
Display & Interface Controllers: -
Ethernet: 10/100/1000 Mbps (3)
SATA: -
USB: USB 2.0 + PHY (2)
Voltage - I/O: -
Operating Temperature: -40°C ~ 105°C (TA)
Security Features: Cryptography, Random Number Generator
Package / Case: 689-BBGA Exposed Pad
Supplier Device Package: 689-TEPBGA II (31x31)

封裝: 689-BBGA Exposed Pad

庫存3,776

MCIMX6D6AVT10ADR

NXP

IC MPU I.MX6D 1.0GHZ 624FCBGA

Core Processor: ARM? Cortex?-A9
Number of Cores/Bus Width: 2 Core, 32-Bit
Speed: 1.0GHz
Co-Processors/DSP: Multimedia; NEON? SIMD
RAM Controllers: LPDDR2, LVDDR3, DDR3
Graphics Acceleration: Yes
Display & Interface Controllers: Keypad, LCD
Ethernet: 10/100/1000 Mbps (1)
SATA: SATA 3Gbps (1)
USB: USB 2.0 + PHY (4)
Voltage - I/O: 1.8V, 2.5V, 2.8V, 3.3V
Operating Temperature: -40°C ~ 125°C (TJ)
Security Features: ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Package / Case: 624-FBGA, FCBGA
Supplier Device Package: 624-FCBGA (21x21)

封裝: 624-FBGA, FCBGA

庫存2,768

PC9S08AC128CFUE

NXP

IC MCU 8BIT 128KB FLASH 64QFP

Core Processor: S08
Core Size: 8-Bit
Speed: 40MHz
Connectivity: I2C, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 54
Program Memory Size: 128KB (128K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 8K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 5.5 V
Data Converters: A/D 16x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 64-QFP
Supplier Device Package: 64-QFP (14x14)

封裝: 64-QFP

庫存3,744

P87LPC764BDH,512

NXP

IC MCU 8BIT 4KB OTP 20TSSOP

Core Processor: 8051
Core Size: 8-Bit
Speed: 20MHz
Connectivity: I2C, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, WDT
Number of I/O: 18
Program Memory Size: 4KB (4K x 8)
Program Memory Type: OTP
EEPROM Size: -
RAM Size: 128 x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 6 V
Data Converters: -
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
Mounting Type: -
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Supplier Device Package: 20-TSSOP

封裝: 20-TSSOP (0.173", 4.40mm Width)

庫存7,744

MMC2114CFCVF33

NXP

IC MCU 32BIT 256KB FLASH 196BGA

Core Processor: M210
Core Size: 32-Bit
Speed: 33MHz
Connectivity: EBI/EMI, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 104
Program Memory Size: 256KB (256K x 8)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 196-LBGA
Supplier Device Package: 196-MAPBGA (15x15)

封裝: 196-LBGA

庫存5,040

MPC5125YVN400R

NXP

IC MCU 32BIT ROMLESS 324TEPBGA

Core Processor: e300
Core Size: 32-Bit
Speed: 400MHz
Connectivity: CAN, EBI/EMI, Ethernet, I2C, USB OTG
Peripherals: DMA, WDT
Number of I/O: 64
Program Memory Size: -
Program Memory Type: ROMless
EEPROM Size: -
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.08 V ~ 3.6 V
Data Converters: -
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TJ)
Mounting Type: -
Package / Case: 324-BBGA
Supplier Device Package: 324-TEPBGA (23x23)

封裝: 324-BBGA

庫存6,400

S9S12GN32F0CLFR

NXP

IC MCU 16BIT 32KB FLASH 48LQFP

Core Processor: 12V1
Core Size: 16-Bit
Speed: 25MHz
Connectivity: IrDA, LIN, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 40
Program Memory Size: 32KB (32K x 8)
Program Memory Type: FLASH
EEPROM Size: 1K x 8
RAM Size: 2K x 8
Voltage - Supply (Vcc/Vdd): 3.13 V ~ 5.5 V
Data Converters: A/D 8x10b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存4,672

MC56F82746VLF

NXP

IC MCU 32BIT 64KB FLASH 48LQFP

Core Processor: 56800EX
Core Size: 32-Bit
Speed: 100MHz
Connectivity: CAN, I2C, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Number of I/O: 39
Program Memory Size: 64KB (32K x 16)
Program Memory Type: FLASH
EEPROM Size: -
RAM Size: 4K x 16
Voltage - Supply (Vcc/Vdd): 2.7 V ~ 3.6 V
Data Converters: A/D 10x12b; D/A 2x12b
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
Mounting Type: -
Package / Case: 48-LQFP
Supplier Device Package: 48-LQFP (7x7)

封裝: 48-LQFP

庫存7,668

PCK9446BD,151

NXP

IC CLK BUFFER 2:10 250MHZ 32LQFP

Type: Fanout Buffer (Distribution), Divider, Multiplexer
Number of Circuits: 1
Ratio - Input:Output: 2:10
Differential - Input:Output: No/No
Input: LVCMOS
Output: LVCMOS
Frequency - Max: 250MHz
Voltage - Supply: 2.375 V ~ 3.465 V
Operating Temperature: -40°C ~ 85°C
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Supplier Device Package: 32-LQFP (7x7)

封裝: 32-LQFP

庫存3,840

PCKV857DGG,512

NXP

IC CLK BUF DDR 190MHZ 1CIRC

PLL: Yes
Main Purpose: Memory, DDR, SDRAM
Input: SSTL-2
Output: SSTL-2
Number of Circuits: 1
Ratio - Input:Output: 1:10
Differential - Input:Output: Yes/Yes
Frequency - Max: 190MHz
Voltage - Supply: 2.3 V ~ 2.7 V
Operating Temperature: 0°C ~ 70°C
Mounting Type: Surface Mount
Package / Case: 48-TFSOP (0.240", 6.10mm Width)
Supplier Device Package: 48-TSSOP

封裝: 48-TFSOP (0.240", 6.10mm Width)

庫存2,592

MMA5212AKW

NXP

ACCELEROMETER 120G SPI 16QFN

Type: Digital
Axis: X
Acceleration Range: ±120g
Sensitivity (LSB/g): 4
Sensitivity (mV/g): -
Bandwidth: -
Output Type: SPI
Voltage - Supply: 4.2 V ~ 17 V
Features: -
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN (6x6)

封裝: 16-QFN Exposed Pad

庫存4,896

MMA6853BKCWR2

NXP

ACCELEROMETER 10BIT SPI 16QFN

Type: Digital
Axis: X, Y
Acceleration Range: -
Sensitivity (LSB/g): -
Sensitivity (mV/g): -
Bandwidth: -
Output Type: SPI
Voltage - Supply: 3.135 V ~ 5.25 V
Features: -
Operating Temperature: -40°C ~ 105°C
Mounting Type: Surface Mount
Package / Case: 16-QFN Exposed Pad
Supplier Device Package: 16-QFN-EP (6x6)

封裝: 16-QFN Exposed Pad

庫存7,938

MW5IC2030MBR1

NXP

IC PWR AMP RF 26V 30W TO-272-16

Frequency: 1.93GHz ~ 1.99GHz
P1dB: -
Gain: 23dB
Noise Figure: -
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Current - Supply: 160mA
Test Frequency: -
Package / Case: TO-272-16 Variant, Flat Leads
Supplier Device Package: TO-272 WB-16

封裝: TO-272-16 Variant, Flat Leads

庫存17,544

MMZ09332BT1

NXP

IC AMP HBT INGAP

Frequency: 130MHz ~ 1GHz
P1dB: 32dBm
Gain: 31dB
Noise Figure: -
RF Type: LTE, TDS-CDMA, W-CDMA
Voltage - Supply: 5V
Current - Supply: 240mA
Test Frequency: 1GHz
Package / Case: 12-VFQFN Exposed Pad
Supplier Device Package: 12-QFN (3x3)

封裝: 12-VFQFN Exposed Pad

庫存7,506

UJA1135HW/5V0Y

NXP

IC TRANSCEIVER

Applications: -
Current - Supply: -
Voltage - Supply: -
Operating Temperature: -
Mounting Type: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,120

LS1012AXN7EKB

NXP

LS1012A XT 600MHZ RV2

Core Processor: -
Number of Cores/Bus Width: -
Speed: -
Co-Processors/DSP: -
RAM Controllers: -
Graphics Acceleration: -
Display & Interface Controllers: -
Ethernet: -
SATA: -
USB: -
Voltage - I/O: -
Operating Temperature: -
Security Features: -
Package / Case: -
Supplier Device Package: -

封裝: -

庫存7,440

S912XET512BMAGR

NXP

16-BIT MCU S12X CORE 512KB FLA

Core Processor: HCS12X
Core Size: 16-Bit
Speed: 50MHz
Connectivity: CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Number of I/O: 119
Program Memory Size: 512KB (512K x 8)
Program Memory Type: FLASH
EEPROM Size: 4K x 8
RAM Size: 32K x 8
Voltage - Supply (Vcc/Vdd): 1.72 V ~ 5.5 V
Data Converters: A/D 24x12b
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: -
Package / Case: 144-LQFP
Supplier Device Package: 144-LQFP (20x20)

封裝: 144-LQFP

庫存6,480