Hirose has introduced the DF52 Series, a miniature 0.8mm pitch wire-to-board connector that delivers up to 2.5A per contact. With a height of only 1.75mm and a depth of just 4.1mm, the tiny wire-to-board connector provides significant PCB space savings.
Alliance Memory has introduced a new monolithic high-speed, low-voltage CMOS double data rate 3 synchronous DRAM (DDR3L SDRAM) with an 8Gb density in the 96-ball, 9mm x 14mm, lead (Pb)-free FBGA package. Featuring state-of-the art silicon provided by Micron Technology, Inc., the AS4C512M16D3L (512M x 16) offers a double data rate architecture for extremely fast transfer rates of up to 1600 Mbps/pin and clock rates of 800MHz.
A new highly-integrated high-voltage multi-chemistry synchronous step-down battery charger controller, with onboard telemetry functions, the LTC4015 has been introduced by Linear Technology. The device efficiently transfers power from a variety of input sources, such as wall adapters and solar panels, to a Li-Ion/Polymer, LiFePO4 or lead-acid battery stack and system load up to 35V.
Renesas has introduced its smallest R-Car-based development kit to date - the ADAS Starter Kit – based on Renesas’ high-end R-Car H2 System on Chip (SoC) and developed to help simplify and speed up the development of advanced driver assistance systems (ADAS) applications.
Fluke’s BT500 Series of battery analysers is designed to make the maintenance of mission-critical battery back-up systems in data centres, telecom networks and power distribution systems easy.
The Texas Instruments (TI) DRV2700 is a single-chip piezo driver with an integrated 105V boost switch, integrated power diode, and integrated fully-differential amplifier. The versatile device is capable of driving both high-voltage and low-voltage piezoelectric loads.
PUI Audio’s new SMT-0440 surface-mount transducer which is 20% smaller than its predecessor allowing designers to add sound to even smaller devices.
The ultra compact STMicroelectronics HTS221 capacitive digital sensor is aimed at relative humidity and temperature applications. The device includes a sensing element and a mixed-signal ASIC to provide the measurement information through digital serial interfaces.
Fairchild Semiconductor’s FIS1100 intelligent MEMS inertial measurement unit (IMU) is a complete 6D MEMS IMU with sensor fusion to specify system level orientation accuracy.
Bud Industries’ DMX extruded aluminium DIN-rail extruded aluminium enclosures. The versatile and convenient boxes feature plastic panels and are offered in six different widths and multiples of three terminals.
Featuring 4th-generation Intel Core i7/i5/i3 processors, ADLINK cExpress-HL compact COM Express Type 6 modules. The cExpress-HL module targets users who need exceptional processing and graphics performance with low power consumption and long product life.
Toshiba’s TC358778XBG parallel port to MIPI display serial interface (DSI) is aimed at applications such as smartphones, tablets and ulltrabooks.
A new wireless solution that supports the Bluetooth Smart near field wireless communication standard, the RL78/G1D Group of microcontrollers (MCUs) has been developed by Renesas.
Linear Technology has introduced the LT8494, a new current-mode, fixed frequency SEPIC / boost DC-DC converter with an internal 2A, 70V switch. Ultralow quiescent current of only 7µA makes the device ideal for always-on automotive or other industrial battery powered systems.
Vishay has introduced a new series of mini radial-leaded positive temperature coefficient (PTC) sensing thermistors
Murata PKGS Series vibration sensors, the two-terminal devices detect acceleration and shock as electrical signals. Using bimorph piezo elements clamped at the one-end (Cantilever construction) with original polarization technology, these shock sensors have high sensitivity and excellent durability.
Texas Instruments’ (TI) DAQ expanded motor driver portfolio offers a 12V motor driver family that reduces spin-up time to just seconds and makes tuning stepper and brushed DC motors easier.
NXP’s PN7120 NFC controllers which support various transmission modes, and include an ARM Cortex-M0 MCU with integrated firmware supporting the NCI 1.0 host communication.
