Latest Technologies | Buffered operational amplifier eliminates the complexity of DAQ front-end measurement | Heisener Electronics
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2022-10-01, Buffered operational amplifier eliminates the complexity of DAQ front-end measurement

BUF802 high-speed buffering operational amplifier from Texas Instruments. The device exponentially raises signal bandwidth in data acquisition systems, allowing design engineers to scale front-end designs across multiple data-acquisition applications for various test and measurement applications, including oscilloscopes, active probes and high-frequency data-acquisition systems.

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2022-09-30, Vishay Introduces Resonant Transformer/Inductor to Save Board Space and Simplify PCB Layout for LLC Applications

Vishay Intertechnology, Inc. announces the launch of a new resonant transformer, the MRTI5R5EZ, in a monomer package for transformers and integrated inductors for inductor-inductor-capacitor (LLC) applications. 5.5kW Vishay Custom Magnetics MRTI5R5EZ saves PCB space while simplifying layout, reducing required installation components, fully adjustable magnetization and leakage inductance, and small parasitic parameters.

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2022-09-30, RECOM Introduces Surface Mount DC/DC Converters Expanding to 3W Output at High Temperatures

RECOM has expanded its range of DC/DC converters with the new surface-mount 3W isolated RSH series with a wide input range. The series has nominal inputs of 12V (9-18 v) and 24V (18-36 v) for battery or bus-powered systems. The output is 5V, 12V, 15V, 24V, +/-12V and +/-15V. These modules have short circuit and overcurrent protection and require only A simple external filter to meet EN 55032 Class A or B input noise requirements. The module has no minimum load requirement, and the on/off control is standard configuration.

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2022-09-30, ON Semiconductor launches 3 SiC-based automotive power modules for on-board chargers

Onsemi has introduced three silicon carborundum based power modules with die-casting die technology for on-board charging and high-voltage DCDC conversion in all types of electric vehicles. The APM32 series is an industry-first combination of SiC technology and die casting package to improve energy efficiency and shorten xEV charging time. It is designed for high-power vehicle chargers from 11 kW to 22 kW (" OBC ").

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2022-09-30, Renesas Electronics Releases RZ/V Series Devices with Built-in Vision AI Accelerator for Accurate Image Recognition and Multi-Camera Image Support

Renesas Electronics announced the launch of a new RZ/V2MA device capable of processing image data from multiple cameras, further expanding its RZ/V family of microprocessors (MPU) product line and bringing a new level of high-precision image recognition to vision AI applications.

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2022-09-30, Qualcomm's 5G RAN platform is sampled, demonstrating the strong momentum of fully open RAN commercial use

Qualcomm Technologies, Inc., announced that the Qualcomm X100 5G RAN Accelerator Card and Qualcomm QRU100 5G RAN Platform are starting to demo to customers and partners worldwide to integrate and validate next-generation 5G mobile infrastructure solutions.

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2022-09-30, Boreas BOS1921 Meets Demand for High-Performance Low-Cost Haptic Functions in Ultra-thin PC Trackpads

Boreas Technologies has introduced the BOS1921 micro piezoelectric actuator, which provides autonomous operation and sensing capabilities for piezoelectric haptic trackpads in a single chip, unlike other piezoelectric actuators that require dedicated forcy-sensing electronics, bringing savings to PC Oems

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2022-09-30, The Silicon Labs xGM240P module radio board combines multi-protocol wireless modules with a 2.4 GHz grid and Bluetooth network

Silicon Labs xGM240P radio board is designed to work with the WSTK main board (not included) to support the development of 2.4 GHz wireless IoT devices for protocols including Bluetooth Low Energy (BLE), Bluetooth mesh, Thread, Matter, and Zigbee. The xGM240P module radio board comes in +10 dBm and +20 dB.

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2022-09-29, Silicon Labs Introduces New 2.4 GHz Wireless PCB Modules

Silicon Labs launches a new 2.4 GHz wireless PCB module to provide IoT device manufacturers with a faster and simpler development process. As an expansion product of the BG24 and MG24 series of wireless SoCs, this series of modules can be more flexible to create smarter, more Faster, more energy-efficient applications while protecting end-user privacy

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2022-09-29, Renesas Electronics Introduces ClockMatrix System Synchronizer

Renesas Electronics Introduces ClockMatrix System Synchronizer, Achieves Class D Compliance for O-RAN S-Plane Requirements, ClockMatrix Device Provides Synchronization and Software Solutions for AMD RFSoC DFE Development Platform and O-RU Reference Design

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2022-09-29, Teledyne Introduces Contact Image Sensor for High Speed, High Resolution Line Scan Imaging

Teledyne DALSA has introduced AxCIS, a new family of high-speed high-resolution fully integrated line scan imaging modules. The easy-to-use contact Image sensor (CIS) combines sensors, lenses, and lights into one, making it a low-cost detection system suitable for many demanding machine vision applications.

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2022-09-29, NORD launches new MAXXDRIVE XD industrial gearbox for a wide range of lifting gear

Lifting applications have special requirements for the installation space of the drive device. Nordisk's new MAXXDRIVE XD is an industrial gearbox with a larger center distance, ideal for U-shaped drives, motors and cable reels.

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2022-09-29, The best DC-DC converter ICs for ADAS provide stable operation

ROHM designed the buck DC-DC converter IC with built-in MOSFET (switching regulator), BD9S402MUF-C, for automotive applications covering infotainment and ADAS, including onboard sensors and cameras that are becoming more advanced.

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2022-09-29, The MCU provides advanced functionality typically found on expensive devices

Microchip Technology Inc has released the PIC32CM JH MCU. This is the industry's first MCU based on the Arm Cortex-M0+ architecture, supporting AUTOSAR, mist and secure boot.