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Continue to expand the GaN RF power mix

Technology Cover
發佈日期: 2020-10-13, Microchip Technology

   The new MMIC and discrete transistors significantly expand its GaN RF power device family by covering frequencies up to 20GH with microchip technology. High PAE and high linearity are the combination of this equipment, generating new levels of performance in applications ranging from 5G to electronic warfare, satellite communications, to commercial and defense radar systems and test equipment.

   As with all GaN RF power products, the device uses GAN-on-sic technology, which provides an optimal combination of high power density and yield, and provides high voltage operation and over 1 million hours of life at 255C junction temperatures.

    They include GaN Mmics covering 2GHz to 18GHz, 12GHz to 20GHz, and 12GHz to 20GHz, respectively, with 3dB compression point (P3dB) RF output power up to 20W and efficiency up to 25%, bare-mode and packaged GaN MMIC amplifiers in THE S and X bands and up to 60% PAE. Maximum efficiency of 70%, discrete HEMT devices cover DC to 14GHz, P3dB rf output up to 100W.

    Leon gross, vice president of microchip discrete products division, said: "microchip continues to invest in our Gan RF series products to support all applications at all frequencies from microwave to millimeter wave. Our product portfolio includes more than 50 devices, ranging from low power consumption level to 2.2kW." "The frequency bands of these products released today range from 2GHz to 20GHz. They are designed to meet the linearity and efficiency challenges brought by the high-order modulation technology used in 5g and other wireless networks, as well as the unique needs of satellite communication and defense applications."

   The product portfolio of RF semiconductors and GaN devices ranges from GaAs RF amplifiers and modules to low noise amplifiers, RF field-effect transistors, pressure-sensitive diodes, Schottky and PIN diodes, RF switches and variable voltage attenuators.

   In addition, the company offers high-performance SAW sensors and MEMS oscillators that support major short-range wireless communication protocols from Bluetooth to Wi-Fi to LoRa. And a highly integrated module that combines MCU with RF transceiver (Wi-Fi MCU).

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