Rohm presents at 2023 PCIM Europe with high performance solutions | 黑森爾電子
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Rohm presents at 2023 PCIM Europe with high performance solutions

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發佈日期: 2023-05-10, Rohm Semiconductor

Rohm, the world's leading semiconductor manufacturer, will participate in 2023PCIM Europe, which will be held in Nuremberg, Germany, from May 9 to 11. PCIM Europe is the world's top exhibition and seminar for the power electronics industry. At that time, ROM will showcase its new power semiconductors that advance sustainable technologies, including high-performance solutions for the electric vehicle sector and beyond.

Semiconductors and electronic components, Rohm's core products, are growing in importance, especially in achieving a decarbonized society, which is an urgent matter of securing the future for future generations. Around energy conservation, miniaturization, functional safety, innovation and sustainability, ROM will provide advanced solutions for the key technologies of this era at PCIM Europe. Under the slogan "Grow with Roma", it shows how it solves social and ecological challenges through high quality technology.


Product highlights include:

The 4th generation SiC MOSFET:The advanced SiC MOSFET technology achieves industry-leading low on-resistance, sufficiently reduces switching losses, and supports both 15V and 18V grid-source voltages, helping to achieve significant miniaturization and low power consumption in a variety of applications including automotive inverters and a variety of switching power supplies.

New molded SiC power modules: Rohm has expanded its package portfolio with "HSDIP20" and "DOT247" with the latest 4th generation SiC MosFEts built in. 750V and 1200V devices with different RDS (on). The "HSDIP" features H bridge (4in1) and three-phase full bridge (6in1) configurations with built-in isolation to ensure compact applications. The DOT247 is a unique half-bridge (2in1) configuration package for more robust performance under power cycle stress. Both can achieve power applications of up to 30kW depending on their conditions.

Grid Driver: The BM611x series is a 3.75kV isolated, AEC-Q100-certified grid driver designed for xEV traction inverter applications. There is a new addition to the product family: the BM6112 is designed for high power IGBT and SiC applications with a gate driven current of 20A.

Intelligent Low Side Power Devices (IPDs) : ROM has released a new generation of single - and dual-channel 40V intelligent low side switches BV1LExxxEFJ-C and BM2LExxxFJ-C series. Both product lines are designed specifically for automotive and industrial applications. Products are AEC-Q100 certified and are suitable for systems such as body control, engine and transmission control units, LED lighting modules or industrial PLC (Programmable logic Controller).

730V Integrated Flyback Converter: The BM2P06xMF IC series integrates the 730V voltage resistant MOSFET and PWM controller in one package. Without any additional heat sink, discharge resistor or capacitor, can help designers shorten the design time, simplify the circuit, reduce costs, improve reliability, ideal for industrial auxiliary power and switching power applications.

AC-DC Converter IC: BM2SC12xFP2-LBZ series is a quasi resonant AC-DC converter, for a variety of external AC power products to provide a better system. Quasi-resonant operation enables soft switching and helps keep EMI low. Built-in 1700V SiC (silicon carbide) MOSFET for easy design. Effectively reduce power consumption under light load. With a variety of protection functions.

The 150V GaN HEMT: Rohm's 150V GaN HEMT GNE10xxTB is optimized for power circuits in industrial and communications equipment with the highest (8V) grid voltage tolerance technology. Rohm will be showcasing enhancements to the IGBT and GaN portfolio at this show.

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