頁 139 - Aries Electronics 產品 - IC、電晶體用插槽

48-6552-18

Aries Electronics

CONN IC DIP SOCKET ZIF 48POS

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Operating Temperature: -55°C ~ 250°C

封裝: -

庫存8,928

48 (2 x 24)

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled

-55°C ~ 250°C

48-3553-18

Aries Electronics

CONN IC DIP SOCKET ZIF 48POS

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Operating Temperature: -55°C ~ 250°C

封裝: -

庫存4,680

48 (2 x 24)

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled

-55°C ~ 250°C

48-3552-18

Aries Electronics

CONN IC DIP SOCKET ZIF 48POS

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Operating Temperature: -55°C ~ 250°C

封裝: -

庫存6,552

48 (2 x 24)

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled

-55°C ~ 250°C

48-3551-18

Aries Electronics

CONN IC DIP SOCKET ZIF 48POS

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 48 (2 x 24)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Operating Temperature: -55°C ~ 250°C

封裝: -

庫存8,064

48 (2 x 24)

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled

-55°C ~ 250°C

44-6554-18

Aries Electronics

CONN IC DIP SOCKET ZIF 44POS

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 44 (2 x 22)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Operating Temperature: -55°C ~ 250°C

封裝: -

庫存4,068

44 (2 x 22)

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled

-55°C ~ 250°C

44-3554-18

Aries Electronics

CONN IC DIP SOCKET ZIF 44POS

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 44 (2 x 22)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Operating Temperature: -55°C ~ 250°C

封裝: -

庫存6,354

44 (2 x 22)

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled

-55°C ~ 250°C

273-PRS21004-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存3,618

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 125°C

257-PGG20012-10

Aries Electronics

CONN SOCKET PGA GOLD

Type: -
Number of Positions or Pins (Grid): -
Pitch - Mating: -
Contact Finish - Mating: -
Contact Finish Thickness - Mating: -
Contact Material - Mating: -
Mounting Type: -
Features: -
Termination: -
Pitch - Post: -
Contact Finish - Post: -
Contact Finish Thickness - Post: -
Contact Material - Post: -
Housing Material: -
Operating Temperature: -

封裝: -

庫存7,272

-

336-PRS21022-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存7,884

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 125°C

336-PLS21022-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存6,696

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 125°C

36-6575-18

Aries Electronics

CONN IC DIP SOCKET ZIF 36POS TIN

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

封裝: -

庫存5,058

36 (2 x 18)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled

-

36-6574-18

Aries Electronics

CONN IC DIP SOCKET ZIF 36POS TIN

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

封裝: -

庫存6,498

36 (2 x 18)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled

-

36-3575-18

Aries Electronics

CONN IC DIP SOCKET ZIF 36POS TIN

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

封裝: -

庫存8,928

36 (2 x 18)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled

-

36-3574-18

Aries Electronics

CONN IC DIP SOCKET ZIF 36POS TIN

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 36 (2 x 18)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

封裝: -

庫存2,538

36 (2 x 18)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled

-

42-6554-18

Aries Electronics

CONN IC DIP SOCKET ZIF 42POS

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Operating Temperature: -55°C ~ 250°C

封裝: -

庫存8,028

42 (2 x 21)

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled

-55°C ~ 250°C

42-3554-18

Aries Electronics

CONN IC DIP SOCKET ZIF 42POS

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 42 (2 x 21)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Housing Material: Polyetheretherketone (PEEK), Glass Filled
Operating Temperature: -55°C ~ 250°C

封裝: -

庫存6,516

42 (2 x 21)

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Polyetheretherketone (PEEK), Glass Filled

-55°C ~ 250°C

336-PRS20021-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存2,358

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 125°C

336-PRS20019-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存8,964

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 125°C

336-PLS20021-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存2,952

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 125°C

336-PLS20019-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存6,552

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 125°C

169-PLS13001-16

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 200°C

封裝: -

庫存7,776

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Bronze

50µin (1.27µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 200°C

169-PRS13001-16

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 200°C

封裝: -

庫存4,518

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Bronze

50µin (1.27µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 200°C

144-PRS15026-16

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 200°C

封裝: -

庫存4,194

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Bronze

50µin (1.27µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 200°C

299-PRS20009-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存8,892

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 125°C

299-PLS20009-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存4,680

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 125°C

300-PRS20006-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存3,402

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 125°C

300-PLS20006-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存6,588

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 125°C

361-PLS19001-12

Aries Electronics

CONN SOCKET PGA ZIF GOLD

Type: PGA, ZIF (ZIP)
Number of Positions or Pins (Grid): -
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS)
Operating Temperature: -65°C ~ 125°C

封裝: -

庫存3,762

-

0.100" (2.54mm)

Gold

30µin (0.76µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS)

-65°C ~ 125°C

32-6575-18

Aries Electronics

CONN IC DIP SOCKET ZIF 32POS TIN

Type: DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200µin (5.08µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200µin (5.08µm)
Contact Material - Post: Beryllium Copper
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

封裝: -

庫存7,092

32 (2 x 16)

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Tin

200µin (5.08µm)

Beryllium Copper

Polyphenylene Sulfide (PPS), Glass Filled

-

32-3575-18

Aries Electronics

CONN IC DIP SOCKET ZIF 32POS

Type: DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid): 32 (2 x 16)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Nickel Boron
Contact Finish Thickness - Mating: 50µin (1.27µm)
Contact Material - Mating: Beryllium Nickel
Mounting Type: Through Hole
Features: Closed Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Boron
Contact Finish Thickness - Post: 50µin (1.27µm)
Contact Material - Post: Beryllium Nickel
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature: -

封裝: -

庫存7,218

32 (2 x 16)

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Through Hole

Closed Frame

Solder

0.100" (2.54mm)

Nickel Boron

50µin (1.27µm)

Beryllium Nickel

Polyphenylene Sulfide (PPS), Glass Filled

-