圖片 |
零件編號 |
製造商 |
描述 |
封裝 |
庫存 |
數量 |
Number of Positions or Pins (Grid) | Pitch - Mating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Type | Features | Termination | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Operating Temperature |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS GLD
|
封裝: - |
庫存8,784 |
|
48 (2 x 24) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS TIN
|
封裝: - |
庫存2,934 |
|
48 (2 x 24) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
封裝: - |
庫存3,436 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
封裝: - |
庫存4,932 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS TIN
|
封裝: - |
庫存2,556 |
|
44 (2 x 22) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS TIN
|
封裝: - |
庫存3,672 |
|
44 (2 x 22) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS TIN
|
封裝: - |
庫存5,058 |
|
44 (2 x 22) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 44POS TIN
|
封裝: - |
庫存5,976 |
|
44 (2 x 22) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
封裝: - |
庫存3,078 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
封裝: - |
庫存3,996 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS TIN
|
封裝: - |
庫存2,376 |
|
42 (2 x 21) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS TIN
|
封裝: - |
庫存7,776 |
|
42 (2 x 21) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS TIN
|
封裝: - |
庫存4,320 |
|
42 (2 x 21) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 42POS TIN
|
封裝: - |
庫存6,858 |
|
42 (2 x 21) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
封裝: - |
庫存3,852 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS
|
封裝: - |
庫存7,740 |
|
48 (2 x 24) | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS
|
封裝: - |
庫存6,192 |
|
48 (2 x 24) | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS TIN
|
封裝: - |
庫存3,384 |
|
40 (2 x 20) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS GLD
|
封裝: - |
庫存6,984 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS TIN
|
封裝: - |
庫存3,384 |
|
40 (2 x 20) | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 40POS GLD
|
封裝: - |
庫存8,262 |
|
40 (2 x 20) | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 10µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled | - |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
封裝: - |
庫存4,500 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
封裝: - |
庫存7,794 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
封裝: - |
庫存4,716 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
封裝: - |
庫存2,664 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
封裝: - |
庫存2,430 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
封裝: - |
庫存4,374 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Bronze | 50µin (1.27µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 200°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
封裝: - |
庫存3,726 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
||
Aries Electronics |
CONN SOCKET PGA ZIF GOLD
|
封裝: - |
庫存6,678 |
|
- | 0.100" (2.54mm) | Gold | 30µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 200µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS) | -65°C ~ 125°C |
||
Aries Electronics |
CONN IC DIP SOCKET ZIF 48POS
|
封裝: - |
庫存8,946 |
|
48 (2 x 24) | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Nickel Boron | 50µin (1.27µm) | Beryllium Nickel | Polyetheretherketone (PEEK), Glass Filled | -55°C ~ 250°C |